Publications of Lihong Feng

Journal Article (42)

2014
Journal Article
Li, S.; Yue, Y.; Feng, L.; Benner, P.; Seidel-Morgenstern, A.: Model Reduction for Linear Simulated Moving Bed Chromatography Systems Using Krylov-Subspace Methods. AIChE-Journal 60 (11), pp. 3773 - 3783 (2014)
2013
Journal Article
Feng, L.; Benner, P.; Korvink, J. G.: Subspace Recycling Accelerates the Parametric Macro‐modeling of MEMS. International Journal for Numerical Methods in Engineering 94 (1), pp. 84 - 110 (2013)

Book (1)

2013
Book
Bechtold, T.; Schrag, G.; Feng, L. (Eds.): System-level Modeling of MEMS. Wiley-VCH, Weinheim (2013), 530 pp.

Book Chapter (16)

2023
Book Chapter
Korvink, J.; Poletkin, K.; Deng, Y.; Feng, L.: A digital twin for MEMS and NEMS. In: Springer Handbook of Semiconductor Devices, Part 4, Modeling, pp. 1303 - 1334 (Eds. Rudan, M.; Brunetti, R.; Reggiani, S.). Springer, Cham, Switzerland (2023)
2022
Book Chapter
Chellappa, S.; Feng, L.; Benner, P.: An Adaptive Sampling Approach for the Reduced Basis Method. In: Realization and Model Reduction of Dynamical Systems – A Festschrift in Honor of 70th Birthday of Thanos Antoulas, pp. 137 - 155 (Eds. Beattie, C.; Benner, P.; Embree, M.; Gugercin, S.; Lefteriu, S.). Springer International Publishing, Cham (2022)
2021
Book Chapter
Benner, P.; Feng, L.: Model Order Reduction based on Moment-Matching. In: Model Order Reduction: Volume 1: System- and Data-Driven Methods and Algorithms, pp. 57 - 96 (Eds. Benner, P.; Grivet-Talocia, S.; Quarteroni, A.; Rozza, G.; Schilders, W. et al.). De Gruyter, Berlin, Boston (2021)
Book Chapter
Chellappa, S.; Feng, L.; de la Rubia, V.; Benner, P.: Adaptive Interpolatory MOR by Learning the Error Estimator in the Parameter Domain. In: Model Reduction of Complex Dynamical Systems, pp. 97 - 117 (Eds. Benner, P.; Breiten, T.; Faßbender, H.; Hinze, M.; Stykel, T. et al.). Birkhäuser, Cham (2021)
2019
Book Chapter
Banagaaya, N.; Feng, L.; Benner, P.: Sparse (P)MOR for Electro-Thermal Coupled Problems with Many Inputs. In: Nanoelectronic Coupled Problems Solutions, pp. 311 - 328 (Eds. ter Maten, E. J. W.; Brachtendorf, H.-G.; Pulch, R.; Schoenmaker, W.; De Gersem, H.). Springer International Publishing, Cham (2019)
Book Chapter
Feng, L.; Benner, P.: Parametric Model Order Reduction for Electro-Thermal Coupled Problems. In: Nanoelectronic Coupled Problems Solutions, pp. 293 - 309 (Eds. ter Maten, E. J. W.; Brachtendorf, H.-G.; Pulch, R.; Schoenmaker, W.; De Gersem, H.). Springer International Publishing, Cham (2019)
Book Chapter
Yue, Y.; Feng, L.; Benner, P.; Pulch, R.; Schöps, S.: Reduced Models and Uncertainty Quantification. In: Nanoelectronic Coupled Problems Solutions, pp. 329 - 346 (Eds. ter Maten, E. J. W.; Brachtendorf, H.-G.; Pulch, R.; Schoenmaker, W.; De Gersem, H.). Springer International Publishing, Cham (2019)
2018
Book Chapter
Banagaaya, N.; Feng, L.; Schoenmaker, W.; Meuris, P.; Gillon, R.; Benner, P.: Sparse Model Order Reduction for Electro-Thermal Problems with Many Inputs. In: Scientific Computing in Electrical Engineering, pp. 189 - 202 (Eds. Langer, U.; Amrhein, W.; Zulehner, W.). Springer International Publishing, Cham (2018)
2017
Book Chapter
Banagaaya, N.; Benner, P.; Feng, L.: Parametric Model Order Reduction for Electro-Thermal Coupled Problems with Many Inputs. In: Progress in Industrial Mathematics at ECMI 2016, pp. 263 - 270 (Eds. Quintela, P.; Barral, P.; Gómez, D.; Pena, F. J.; Rodríguez, J. et al.). Springer International Publishing, Cham (2017)
Book Chapter
Feng, L.; Antoulas, A. C.; Benner, P.: Automatic Generation of Reduced Order Models for Linear Parametric Systems. In: Progress in Industrial Mathematics at ECMI 2014, pp. 811 - 818 (Eds. Russo, G.; Capasso, V.; Nicosia, G.; Romano, V.). Springer International Publishing, Cham (2017)
Book Chapter
Janssen, H. H. J. M.; Benner, P.; Bittner, K.; Brachtendorf, H.-G.; Feng, L.; ter Maten, E. J. W.; Pulch, R.; Schoenmaker, W.; Schöps, S.; Tischendorf, C.: The European Project nanoCOPS for Nanoelectronic Coupled Problems Solutions. In: Progress in Industrial Mathematics at ECMI 2014, pp. 835 - 842 (Eds. Russo, G.; Capasso, V.; Nicosia, G.; Romano, V.). Springer International Publishing, Cham (2017)
2016
Book Chapter
Feng, L.; Meuris, P.; Schoenmaker, W.; Benner, P.: Parametric and Reduced-Order Modeling for the Thermal Analysis of Nanoelectronic Structures. In: Scientific Computing in Electrical Engineering, pp. 155 - 163 (Eds. Bartel, A.; Clemens, M.; Günther, M.; ter Maten, E. J. W.). Springer International Publishing, Cham (2016)
2015
Book Chapter
Benner, P.; Breiten, T.; Feng, L.: Matrix Equations and Model Reduction. In: Matrix Functions and Matrix Equations, pp. 50 - 75 (Eds. Bai, Z.; Gao, W.; Su, Y.). World Scientific Publishing, Singapore (2015)
Book Chapter
Benner, P.; Feng, L.; Li, S.; Zhang, Y.: Reduced-Order Modeling and ROM-Based Optimization of Batch Chromatography. In: Numerical Mathematics and Advanced Applications - ENUMATH 2013, pp. 427 - 435 (Eds. Abdulle, A.; Deparis, S.; Kressner, D.; Nobile, F.; Picasso, M.). Springer International Publishing, Cham (2015)
2014
Book Chapter
Benner, P.; Feng, L.: A Robust Algorithm for Parametric Model Order Reduction Based on Implicit Moment Matching. In: Reduced Order Methods for Modeling and Computational Reduction, pp. 159 - 185 (Eds. Quarteroni, A.; Rozza, G.). Springer International Publishing, Cham (2014)
2013
Book Chapter
Feng, L.; Benner, P.; Korvink, J. G.: System-Level Modeling of MEMS by Means of Model Order Reduction (Mathematical Approximation) - Mathematical Background. In: System-level Modeling of MEMS, pp. 53 - 93 (Eds. Bechtold, T.; Schrag, G.; Feng, L.). Wiley-VCH, Weinheim (2013)

Conference Paper (15)

2023
Conference Paper
Mattucci, E.; Feng, L.; Benner, P.; Romano, D.; Antonini, G.: Fast Frequency-Domain Analysis for Parametric Electromagnetic Models Using Deep Learning. In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, October 15, 2023 - October 18, 2023. (2023)
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