Dr. Lihong Feng

Journal Article (1)

1.
Journal Article
Feng, L.; Benner, P.; Korvink, J. G.: Subspace Recycling Accelerates the Parametric Macro‐modeling of MEMS. International Journal for Numerical Methods in Engineering 94 (1), pp. 84 - 110 (2013)

Book (1)

2.
Book
Bechtold, T.; Schrag, G.; Feng, L. (Eds.): System-level Modeling of MEMS. Wiley-VCH, Weinheim (2013), 530 pp.

Book Chapter (1)

3.
Book Chapter
Feng, L.; Benner, P.; Korvink, J. G.: System-Level Modeling of MEMS by Means of Model Order Reduction (Mathematical Approximation) - Mathematical Background. In: System-level Modeling of MEMS, pp. 53 - 93 (Eds. Bechtold, T.; Schrag, G.; Feng, L.). Wiley-VCH, Weinheim (2013)

Conference Paper (1)

4.
Conference Paper
Bechtold, T.; Schrag, G.; Feng, L.: Enabling technologies for system-level simulation of MEMS. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1 - 6. EuroSimE 2013 - 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Wroclaw, Poland, April 14, 2013 - April 17, 2013. (2013)
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